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P/N: CL-O023-GROSGM-A

Thermal paste, Thermaltake TG-30 4G

THERMALTAKE компоненти за компютри >> Thermaltake TG-30 4G Recommended service
Recommended service
Продуктът няма гаранция

 



Characteristic

Compatible with Охлаждащи системи
Features 2 TG-30 is a premium thermal compound for high standard cooling performance designed to lower CPU temperatures effectively.
Features 3 The thermal compound contains diamond powder, which would provide a thermal conductivity of 4.5 W/m-k that could fulfill the user’s primary needs.
Features 4 Density: 2.55 g/cm3
Features 5 Viscosity: 76 Pa-s
Features 6 Thermal impedance: 0.185°C -in2/W
Features 7 Thermaltake’s specially formulated thermal compound fits perfectly with the honeycomb stencil, which provides an easier way to apply your thermal compound for a neat and well-covered surface that fits all CPUs.
Features 8 The high-quality thermal compound provides a longer lifespan of eliminating dry-out or cracking while in use. Non-electrical conductive compound ensures better safety measures for you and your system.
Warranty 0 months

EAN: 4713227525831